SWTest Asia Schedule and Program
tentative schedule subject to change
Program Overview
Day One, Thursday, October 17th, 2019
| EXPO SCHEDULE | |||
|---|---|---|---|
| Time | Activity | ||
| 8:00 |
Exhibitor Registration Open
|
EXPO Setup | |
| 8:30 | |||
| 9:00 | |||
| 9:15 | |||
| 10:15 | Exhibitor Tea Break in the Expo Hall | ||
| 10:30 | |||
| 10:45 | |||
| 11:00 | |||
| 11:30 | |||
| 12:00 | Expo Open | ||
| 12:15 | Lunch in the Expo Hall | ||
| 13:00 | |||
| 13:30 | |||
| 14:00 | |||
| 14:30 | |||
| 15:00 | |||
| 15:30 | PM Break in the Expo hall | ||
| 16:00 | |||
| 16:30 | |||
| 17:00 | |||
| 17:30 | Welcome Reception in the Expo Hall | ||
| 18:00 | |||
| 18:30 | |||
| TECHNICAL SESSIONS | ||
|---|---|---|
| Time | Activity | |
| 8:00 |
Attendee Registration Open
|
|
| 8:30 | ||
| 9:00 | Welcome Address | |
| 9:15 | Keynote Address | |
| 10:15 | Attendee Tea Break in the Lobby | |
| 10:30 | ||
| 10:45 | Technical Presentations #1 | |
| 11:00 | ||
| 11:30 | ||
| 12:00 | ||
| 12:15 | Lunch in the Expo Hall | |
| 13:00 | ||
| 13:30 | ||
| 14:00 | Technical Presentations #2 | |
| 14:30 | ||
| 15:00 | ||
| 15:30 | PM Break in the Expo hall | |
| 16:00 | Technical Presentations #3 | |
| 16:30 | ||
| 17:00 | ||
| 17:30 | Welcome Reception in the Expo Hall | |
| 18:00 | ||
| 18:30 | ||
Tentative Schedule as of 9-5-19, subject to change
Day Two, Friday, October 18th, 2019
| EXPO SCHEDULE | ||
|---|---|---|
| Time | Activity | |
| 8:00 | ||
| 8:30 | ||
| 9:00 | ||
| 9:15 | ||
| 10:15 | Expo Open | Tea Break in the Expo Hall |
| 10:45 | ||
| 11:00 | ||
| 11:30 | ||
| 12:15 | Lunch in the Expo Hall | |
| 12:30 | ||
| 13:00 | ||
| 13:30 | ||
| 14:00 | ||
| 14:30 | ||
| 15:00 | ||
| 15:30 | PM Break in the Expo Hall | |
| 16:00 | ||
| 16:30 | ||
| 17:00 | ||
| 17:45 | Closing Reception in the Expo Hall | |
| 18:00 | ||
| 18:45 | Exhibitor Teardown and Move Out | |
| 19:00 | ||
| 20:00 | ||
| 21:00 | ||
| 22:00 | ||
| TECHNICAL SESSIONS | ||
|---|---|---|
| Time | Activity | |
| 8:00 |
Attendee Registration Open
|
|
| 8:30 | ||
| 9:00 | Welcome Address | |
| 9:15 | Keynote Address | |
| 10:15 | Tea Break in the Expo Hall | |
| 10:45 | Technical Presentations | |
| 11:00 | ||
| 11:30 | ||
| 12:15 | Lunch in the Expo Hall | |
| 12:30 | ||
| 13:00 | ||
| 13:30 | ||
| 14:00 | Technical Presentations | |
| 14:30 | ||
| 15:00 | ||
| 15:30 | PM Break in the Expo Hall | |
| 16:00 | Technical Presentations | |
| 16:30 | ||
| 17:00 | ||
| 17:45 | Closing Reception in the Expo Hall | |
| 18:00 | ||
| 18:45 | ||
| 19:00 | ||
| 20:00 | ||
| 21:00 | ||
| 22:00 | ||
Tentative Schedule as of 9-5-19, subject to change
Detailed Program
Last revised 9/12/19
Thursday, October 17, 2019
09:00: Welcome Address
09:15: Keynote Address
“Industry 3.5” to Empower Intelligent Manufacturing and Empirical Studies in Taiwan
Chen-Fu Chien, Ph.D.
Tsinghua Chair Professor & Micron Chair Professor
Department of Industrial Engineering & Engineering Management
National Tsing Hua University, Hsinchu 30013, Taiwan
10:15: Attendee Tea Break in the Registration Lobby
| 10:45 – 12:15 | Session #1: Challenges for Next-Gen of Wafer Test Session Chair: Dr. Jerry Broz (SWTest Conferences – USA) |
| 10:45 – 11:15 | Advanced Packaging — It’s Changing The World Of Wafer Test Author and Presenter: Amy Leong (FormFactor Inc. – San Jose, USA) |
| 11:15 – 11:45 | Methodology of VCSEL Probing and Testing Authors: Hector Lin, Douglas Tsai, and Gary Liu (MPI Corporation – Chupei, Taiwan) Presenter: Hector Lin (MPI Corporation – Chupei, Taiwan) |
| 11:45 – 12:15 | Probing Technology Challenge: Now and Future Authors: Clark Liu, Henry Tseng, and Jason Sung (PTI – Hsinchu, Taiwan) Presenter: Clark Liu (PTI – Hsinchu, Taiwan) |
12:15: Box Lunch Served in EXPO Hall
Please bring your lunch ticket
| 14:00 – 15:30 | Session #2: Big Data, Big Future Session Chair: Joey Wu (SWTest Member at Large) |
| 14:00 – 14:30 | Wafer Defect Diagnosis With Test Big Data Driven Techniques Authors: Prof. Katherine Shu-Min Li (National Sun Yat-Sen University – Taichung, Taiwan) and Andrew Huang, Chau Cheung Cheng, Chengyen Tsai, Leon Chou, Yi Yu Liao (NXP – Kaohsiung, Taiwan) and Chen Hsun Lee (NXP Semiconductors Kaohsiung – Kaohsiung City, Taiwan) Presenters: Chau Cheung Cheng (NXP Semiconductors Taiwan Ltd. – Kaohsiung, Taiwan) Prof. Katherine Shu-Min Li (National Sun Yat-Sen University – Taichung, Taiwan) |
| 14:30 – 15:00 | Probe Card Electrical Quality Enhancement Using Big Data Analytics Authors: Kenny Huang, Fred Chou, Alex Wei, Steven Wu (MPI Corporation – Zhubei, Taiwan) Ying-Jen Chen (DALab Solutions x Associates Co., Ltd., Taiwan – Hsinchu, Taiwan) Yu-Mei Ling, Yi-Yu Chen and Prof. Chen-Fu Chien (National Tsing Hua University, Taiwan, Artificial Intelligence for Intelligent Manufacturing Systems (AIMS) Research Center, MOST, Taiwan – Hsinchu, Taiwan) Presenter: Steven Wu (MPI Corporation – Zhubei, Taiwan) |
| 15:00 – 15:30 | Testing the Spatial Pattern Randomness on Wafer Maps Authors: Prof. Jwu E Chen, Prof. Hsing-Chung Liang, and Tung Ying Lu (National Central University – Zhongli District, Taoyuan City , Taiwan) Presenters: Prof. Jwu E Chen and Tung Ying Lu (National Central University – Zhongli District, Taoyuan City , Taiwan) |
15:30: Tea Break in EXPO Hall
| 16:00 – 17:30 | Session #3: Challenges in Process Control Monitoring Session Chair: Mr. Nobuhiro Kawamata (FormFactor – Yokohama, Japan) |
| 16:00 – 16:30 | Reducing Wafer Parametric Test Costs By High Speed Test Solution Authors: Yu Cheng Su (National Instruments – Taipei City, Taiwan) Mark Lu (Semitronix – Hangzhou, China) Presenter: Mark Lu (Semitronix – Hangzhou, China) |
| 16:30 – 17:00 | Advances In Position Measurement And Analysis For Guide Plate Microholes Authors: Michael Cullimore and Dr. Alan Ferguson (Oxford Lasers – Didcot, United Kingdom) Presenter: Michael Cullimore (Oxford Lasers – Didcot, United Kingdom) |
| 17:00 – 17:30 | Takumi CL – New 2D-MEMS Spring Introduction to Formfactor Parametric Probe Card and Comparison with 3D MEMS Spring Author and Presenter: Takao Saeki (Formfactor Inc – Hogogaya-ku, Yokohama-shi, Japan) |
17:30: Welcome Reception in EXPO Hall
18:30: End of Activities
Friday, October 18, 2019
09:00: Welcome Address
09:15: Keynote Address
Wafer Test Value and Future
Masahide Ozawa
Technical Consultant
Tokyo Electron Technology Solutions
10:15: Attendee Tea Break in the EXPO Hall
| 10:45 – 12:15 | Session #4: Full Speed Ahead with 5G Solutions Session Chair: Dr. Jerry Broz (SWTest Conferences – USA) |
| 10:45 – 11:15 | Getting Ready For The Next Wave Of Growth Author and Presenter: John West (VLSI Research Europe, United Kingdom) |
| 11:15 – 11:45 | 5g Enhanced Micro-Cantilever Membrane Probing Solutions Authors: Jed Hsu and Jordan Smalls (Translarity, Inc. – Fremont, USA) Presenter: Mr. Jed Hsu (Translarity, Inc. – Fremont, USA) |
| 11:45 – 12:15 | How To Successfully Embrace The Era Of 5g Mmwave Test Author and Presenter: Mr. Yu Cheng Su (National Instruments – Taipei City, Taiwan) |
12:15: Box Lunch Served in EXPO Hall
Please bring your lunch ticket
| 14:00 – 15:30 | Session #5: Advanced Temperature Handling, Space Transformation Session Chair: Dr. Alan Ferguson (Oxford Lasers – Didcot, United Kingdom) |
| 14:00 – 14:30 | Ultra High Temperature Production Probe Card Solution for Automotive IC Testing Authors and Presenters: Alan Liao (FormFactor – USA) and Hirofumi Nagata (FormFactor – Japan) |
| 14:30 – 15:00 | Space Transforming Probes Authors: Gary Grube and Dominik Schmidt (Translarity Inc. – Fremont, USA) Presenter: Dominik Schmidt (Translarity Inc. – Fremont, USA) |
| 15:00 – 15:30 | Temperature Accuracy At High Wattage Wafer Test – A Novel Method To Control Device Temperature Author and Presenter: Mr. Klemens Reitinger (ERS electronic GmbH – Munich, Germany) |
15:30: Tea Break in the EXPO Hall
| 16:00 – 17:00 | Session #6: Advanced Probing Interface Solutions Session Chair: Mr. Clark Liu (PTI – Hsinchu, Taiwan) |
| 16:00 – 16:30 | Overview Of Specialized Testing For Mems Sensors; Wafer Probe & Final Test Author and Presenter: Michael Ricci (Rika Denshi Group, LTD – Tokyo, Japan) |
| 16:30 – 17:00 | A New Framework To Manage Device Interface Complexity For The Next Decade Author and Presenter: Steve Ledford (Teradyne – North Reading, USA) |
| 17:00 – 17:30 | Awards Ceremony |
17:45: Closing Reception in the EXPO Hall
18:45: Conference Ends
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