Program

Wednesday, October 26 – Benefit Golf Tournament

Thursday, October 27

10:00 – 17:00	Attendee Registration Open
10:00 – 13:00	Exhibitor Registration Open
12:00 – 14:00	Exhibitor Registration Open Exhibitor Setup in Expo Hall for 34 Booths – Exhibitors Only
13:00 – 13:15 Space Available Seating	Chairman’s Welcome to SWTest Asia 2022 Opening Remarks Dr. Jerry Broz, SWTest General Chair  Clark Liu, SWTest Technical Program Chair

Technical Session 1: Getting Manufacturing Smarter

Session Chair: Clark Liu (MJC Taiwan – Taiwan)

13:15 – 13.45 Space Available Seating	Probecard Challenges for Expanding Arrays of Fine Pad Pitch Devices to Test Under Wide Temperature Range Pouya Dastmalchi, PhD, and Cameron Harker (Formfactor – USA) Presented by Pouya Dastmalchi, PhD (Formfactor – USA)
13:45 – 14:15 Space Available Seating	TestGeni – Test Development Intelligent Automation Senthil Kumar Dhamodharan, Nachiappan Gnanasambandam, and Vaishnavi Saravanan (Caliber Interconnect Solutions Pvt Ltd – India)
14:15 – 14:45 Space Available Seating	Advanced Testing Technology for Future Requirement  Scott Huang (Kore Semiconductor Co., Ltd. – China)

14:45 – 15:30 – PM Tea Break in EXPO Hall
14:45 – 18:00 – SWTest Asia EXPO Open

Technical Session 2: Meeting Process Challenges

Session Chair: Alex Yang (MPI Corporation – Taiwan)

15:30 – 16.00 Space Available Seating	Thermal Stability and Properties Of PALYSIUM – Revolutionary Probe Material  Dr. Jonas Fecher (Heraeus Deutschland GmbH & Co. KG – Germany)
16:00 – 16:30 Space Available Seating	New Generation of Kelvin Spring Pins Lambert Brost (Technoprobe – USA)   Presented by Ming-Ting Wu (Technoprobe – Taiwan)
16:30 – 17:00 Space Available Seating	Probe Card Market Dynamics in a Turbulent World John West and Lin Fu (Yole Intelligence – United Kingdom)

17:00 – 18:00 – Welcome Reception in Expo Hall

Friday, October 28

8:00 – 14:00	Attendee Registration Open
9:00 – 9:15	Chair’s Opening Remarks for SWTest Asia 2022 Dr. Jerry Broz, SWTest General Chair Clark Liu, SWTest Technical Program Chair
9:15 – 10:15 Space Available Seating	Friday Keynote Presentation in General Session Room Semiconductor, the Information and Communication Technology (ICT) Supply Chain and Geopolitics Colley Hwang Digitimes Founder and Chairman
10:00 – 16:00	SWTest Asia Expo Open
10:15 – 11:00	AM Tea Break in EXPO Hall

Technical Session 3: Test Challenges and Solutions

Session Chair: Dr. Jerry Broz, General Chair (Advanced Probing Systems – USA)

11:00 – 11:30 Space Available Seating	Validation of 55GHz Octal-site Wafer Test Probecard for 5G mmWave device Peter Cockburn (Cohu, Inc. – United Kingdom)
11:30 – 12:00 Space Available Seating	Aging parametric testers versus determining measurement system vitality  Mike Palumbo (Technoprobe – USA)   Presented by Jeff Arasmith (Technoprobe America Inc. – San Jose, USA)
12:00 – 12:30 Space Available Seating	High Parallelism Probe Card on V93K Direct-Probe™ System to Increase Testing Throughput on Automotive IC John Kao (Formfactor – Taiwan)

12:30 – 14:00 – Expo Open – Lunch in Expo Hall – Two Sessions (12:30 – 13:15 & 13:15 – 14:00)

Technical Session 4: Power, Magnets, and Memory

Session Chair: Dr. Alan Ferguson (Oxford Lasers – United Kingdom)

14:00 – 14:30 Space Available Seating	Testing challenges for latest SiC and GaN devices Elia Petrogalli (SPEA S.p.A. – Italy)
14:30 – 15:00 Space Available Seating	Wafer Level Magnetic Testing of STT-MRAM for Process Control and Chip Sorting in Volume Manufacturing Siamak Salimy (Hprobe – France) and Henry Chung (HTSI – Taiwan)
15:00 – 15:30 Space Available Seating	Next Generation DRAM Temperature Requirements and Impacts to Full Wafer Contactor Probe Card Performance Myung Jin Lee (FormFactor – USA) and Hyun Ae Lee (Samsung Electronics – Korea)

15:30 – 16:00 – PM Tea Break in EXPO Hall

Technical Session 5: Testing for the Next Generation

Session Chair: Joey Wu (SWTest Asia Committee Member – Taiwan)

16:00 – 16:30 Space Available Seating	Challenges and Improvement Actions for HPC Wafer Testing Oscar Lee, Harvey Lin, and Hung I Tsai (TSMC – Taiwan)
16:30 – 17:00 Space Available Seating	Known Good Die Memory Wafter Test Challenge Beyond DDR5 4GHz/8Gbps Speed Alan Liao (FormFactor – USA)
17:00 – 17:30 Space Available Seating	High wattage dissipation under temperature – a new method for test evaluation Klemens Reitinger (ERS electronic GmbH – Germany)
17:30 – 17:45 Space Available Seating	Awards for Best Presentations
17:45 – 18:45	Closing Reception in Expo Hall

There will be a total of fifteen 30-minute technical papers, 10 hours of Expo, 3 tea breaks, 1 lunch, and 2 receptions.