Program

SWTest Asia Schedule and Program

tentative schedule subject to change

Program Overview

Day One, Thursday, October 17th, 2019

EXPO SCHEDULE
Time Activity
8:00
Exhibitor Registration Open
EXPO Setup
8:30
9:00
9:15
10:15 Exhibitor Tea Break in the Expo Hall
10:30
10:45
11:00
11:30
12:00 Expo Open
12:15 Lunch in the Expo Hall
13:00
13:30
14:00
14:30
15:00
15:30 PM Break in the Expo hall
16:00
16:30
17:00
17:30 Welcome Reception in the Expo Hall
18:00
18:30
TECHNICAL SESSIONS
Time Activity
8:00
Attendee Registration Open
8:30
9:00 Welcome Address
9:15 Keynote Address
10:15 Attendee Tea Break in the Lobby
10:30
10:45 Technical Presentations #1
11:00
11:30
12:00
12:15 Lunch in the Expo Hall
13:00
13:30
14:00 Technical Presentations #2
14:30
15:00
15:30 PM Break in the Expo hall
16:00 Technical Presentations #3
16:30
17:00
17:30 Welcome Reception in the Expo Hall
18:00
18:30

Tentative Schedule as of 9-5-19, subject to change

Day Two, Friday, October 18th, 2019

EXPO SCHEDULE
Time Activity
8:00
8:30
9:00
9:15
10:15 Expo Open Tea Break in the Expo Hall
10:45
11:00
11:30
12:15 Lunch in the Expo Hall
12:30
13:00
13:30
14:00
14:30
15:00
15:30 PM Break in the Expo Hall
16:00
16:30
17:00
17:45 Closing Reception in the Expo Hall
18:00
18:45 Exhibitor Teardown and Move Out
19:00
20:00
21:00
22:00
TECHNICAL SESSIONS
Time Activity
8:00
Attendee Registration Open
8:30
9:00 Welcome Address
9:15 Keynote Address
10:15 Tea Break in the Expo Hall
10:45 Technical Presentations
11:00
11:30
12:15 Lunch in the Expo Hall
12:30
13:00
13:30
14:00 Technical Presentations
14:30
15:00
15:30 PM Break in the Expo Hall
16:00 Technical Presentations
16:30
17:00
17:45 Closing Reception in the Expo Hall
18:00
18:45
19:00
20:00
21:00
22:00

Tentative Schedule as of 9-5-19, subject to change

Detailed Program

Last revised 9/12/19

Thursday, October 17, 2019

09:00: Welcome Address

09:15: Keynote Address

“Industry 3.5” to Empower Intelligent Manufacturing and Empirical Studies in Taiwan

Chen-Fu Chien, Ph.D.

Tsinghua Chair Professor & Micron Chair Professor
Department of Industrial Engineering & Engineering Management
National Tsing Hua University, Hsinchu 30013, Taiwan

Read more about Dr. Chen-Fu Chien and his keynote abstract

10:15: Attendee Tea Break in the Registration Lobby

10:45 – 12:15 Session #1: Challenges for Next-Gen of Wafer Test
Session Chair: Dr. Jerry Broz (SWTest Conferences – USA)
10:45 – 11:15 Advanced Packaging — It’s Changing The World Of Wafer Test
Author and Presenter: Amy Leong (FormFactor Inc. – San Jose, USA)
11:15 – 11:45 Methodology of VCSEL Probing and Testing 
Authors: Hector Lin, Douglas Tsai, and Gary Liu (MPI Corporation – Chupei, Taiwan)
Presenter: Hector Lin (MPI Corporation – Chupei, Taiwan)
11:45 – 12:15 Probing Technology Challenge: Now and Future 
Authors: Clark Liu, Henry Tseng, and Jason Sung (PTI – Hsinchu, Taiwan)
Presenter: Clark Liu (PTI – Hsinchu, Taiwan)

12:15: Box Lunch Served in EXPO Hall
Please bring your lunch ticket

14:00 – 15:30 Session #2: Big Data, Big Future
Session Chair:  Joey Wu (SWTest Member at Large)
14:00 – 14:30 Wafer Defect Diagnosis With Test Big Data Driven Techniques 
Authors: Prof. Katherine Shu-Min Li (National Sun Yat-Sen University – Taichung, Taiwan) and Andrew Huang, Chau Cheung Cheng, Chengyen Tsai, Leon Chou, Yi Yu Liao (NXP – Kaohsiung, Taiwan) and Chen Hsun Lee (NXP Semiconductors Kaohsiung – Kaohsiung City, Taiwan) 
Presenters: Chau Cheung Cheng (NXP Semiconductors Taiwan Ltd. – Kaohsiung, Taiwan) Prof. Katherine Shu-Min Li (National Sun Yat-Sen University – Taichung, Taiwan)
14:30 – 15:00 Probe Card Electrical Quality Enhancement Using Big Data Analytics 
Authors: Kenny Huang, Fred Chou, Alex Wei, Steven Wu (MPI Corporation – Zhubei, Taiwan)
Ying-Jen Chen (DALab Solutions x Associates Co., Ltd., Taiwan – Hsinchu, Taiwan)
Yu-Mei Ling, Yi-Yu Chen and Prof. Chen-Fu Chien (National Tsing Hua University, Taiwan, Artificial Intelligence for Intelligent Manufacturing Systems (AIMS) Research Center, MOST, Taiwan – Hsinchu, Taiwan)
Presenter: Steven Wu (MPI Corporation – Zhubei, Taiwan)
15:00 – 15:30 Testing the Spatial Pattern Randomness on Wafer Maps
Authors: Prof. Jwu E Chen, Prof. Hsing-Chung Liang, and Tung Ying Lu (National Central University – Zhongli District, Taoyuan City , Taiwan)
Presenters: Prof. Jwu E Chen and Tung Ying Lu (National Central University – Zhongli District, Taoyuan City , Taiwan)

15:30: Tea Break in EXPO Hall

16:00 – 17:30 Session #3: Challenges in Process Control Monitoring
Session Chair: Mr. Nobuhiro Kawamata (FormFactor – Yokohama, Japan)
16:00 – 16:30 Reducing Wafer Parametric Test Costs By High Speed Test Solution 
Authors: Yu Cheng Su (National Instruments – Taipei City, Taiwan) Mark Lu (Semitronix – Hangzhou, China)
Presenter: Mark Lu (Semitronix – Hangzhou, China)
16:30 – 17:00 Advances In Position Measurement And Analysis For Guide Plate Microholes 
Authors: Michael Cullimore and Dr. Alan Ferguson (Oxford Lasers – Didcot, United Kingdom)
Presenter: Michael Cullimore (Oxford Lasers – Didcot, United Kingdom)
17:00 – 17:30 Takumi CL – New 2D-MEMS Spring Introduction to Formfactor Parametric Probe Card and Comparison with 3D MEMS Spring 
Author and Presenter: Takao Saeki (Formfactor Inc – Hogogaya-ku, Yokohama-shi, Japan)

17:30: Welcome Reception in EXPO Hall

18:30: End of Activities

Friday, October 18, 2019

09:00: Welcome Address

09:15: Keynote Address

Wafer Test Value and Future

Masahide Ozawa

Technical Consultant
Tokyo Electron Technology Solutions

Read more about Masahide Ozawa and his keynote abstract

10:15: Attendee Tea Break in the EXPO Hall

10:45 – 12:15 Session #4: Full Speed Ahead with 5G Solutions
Session Chair: Dr. Jerry Broz (SWTest Conferences – USA)
10:45 – 11:15 Getting Ready For The Next Wave Of Growth 
Author and Presenter: John West (VLSI Research Europe, United Kingdom)
11:15 – 11:45 5g Enhanced Micro-Cantilever Membrane Probing Solutions   
Authors: Jed Hsu and Jordan Smalls (Translarity, Inc. – Fremont, USA)
Presenter: Mr. Jed Hsu (Translarity, Inc. – Fremont, USA)
11:45 – 12:15 How To Successfully Embrace The Era Of 5g Mmwave Test
Author and Presenter
: Mr. Yu Cheng Su (National Instruments – Taipei City, Taiwan)

12:15: Box Lunch Served in EXPO Hall
Please bring your lunch ticket

14:00 – 15:30 Session #5: Advanced Temperature Handling, Space Transformation
Session Chair: Dr. Alan Ferguson (Oxford Lasers – Didcot, United Kingdom)
14:00 – 14:30 Ultra High Temperature Production Probe Card Solution for Automotive IC Testing
Authors and Presenters
: Alan Liao (FormFactor – USA) and Hirofumi Nagata (FormFactor – Japan)
14:30 – 15:00 Space Transforming Probes   
Authors: Gary Grube and Dominik Schmidt (Translarity Inc. – Fremont, USA)
Presenter: Dominik Schmidt (Translarity Inc. – Fremont, USA)
15:00 – 15:30 Temperature Accuracy At High Wattage Wafer Test – A Novel Method To Control Device Temperature
Author and Presenter
: Mr. Klemens Reitinger (ERS electronic GmbH – Munich, Germany)

15:30: Tea Break in the EXPO Hall

16:00 – 17:00 Session #6: Advanced Probing Interface Solutions
Session Chair: Mr. Clark Liu (PTI – Hsinchu, Taiwan)
16:00 – 16:30 Overview Of Specialized Testing For Mems Sensors; Wafer Probe & Final Test
Author and Presenter
: Michael Ricci (Rika Denshi Group, LTD – Tokyo, Japan)
16:30 – 17:00 A New Framework To Manage Device Interface Complexity For The Next Decade
Author and Presenter
: Steve Ledford (Teradyne – North Reading, USA)
17:00 – 17:30 Awards Ceremony

17:45: Closing Reception in the EXPO Hall

18:45: Conference Ends

2019 Sponsors

Platinum Sponsors

Gold Sponsors

Silver Sponsors