SWTest Asia 2025
Conference Guide and Exhibitor Directory

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Booth: 405
www.accretech.com

Progressing hand-in-hand with a diverse array of peoples, Tokyo Seimitsu prides itself on its ability to leverage technology, knowledge and information to create the world’s premier products. This unchanging philosophy is personified in our new corporate brand, ACCRETECH. We seek to gather global, cutting-edge technologies across organization, country and region, to overcome challenges and precipitate growth.

Booth: 307
www.advantest.com

Advantest is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, high-performance computing (HPC) including artificial intelligence (AI) and machine learning, and more. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also conducts R&D to address emerging testing challenges and applications; develops advanced test-interface solutions for wafer sort and final test; produces scanning electron microscopes essential to photomask manufacturing; and offers system-level test solutions and other test-related accessories. Founded in Tokyo in 1954, Advantest is a global company with facilities around the world and an international commitment to sustainable practices and social responsibility. More information is available at www.advantest.com.

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Booth: 510
ate.co.jp

ATE Service Corp. provides comprehensive engineering solutions for LSI testing, mainly for semiconductor manufacturers and fabless companies. They offer end-to-end support from design to evaluation and analysis.

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Booth: 306
celadonsystems.com

Celadon Systems is committed to providing reliable and innovative probe cards to meet the most rigorous demands of the semiconductor, medical, quantum computing, space and defense industries. Celadon’s probe cards are engineered to excel in extreme temperature conditions from below 2 Kelvin to over 800C. Specializing in modular and adjustable solutions for MRAM, SiPh/PIC, WLBI, and High Voltage testing, Celadon takes pride in offering the lowest cost of test in the industry with customers achieving millions of touchdowns in both labs and production fabs.

Booth: 217
elspes.com

The Leading Company in Next Generation Passive Devices

Booth: 601
fab-9.com

Fab-9 is a prime supplier of Probe Cards, Test Boards and Load Board to the ATE Semiconductor Industry.

Booth: 211
ft-mt.co.jp

Ferrotec is a world leader in advanced material, component, and system solutions. Ferrotec offers machinable ceramics and ceramic components manufactured using our advanced Photoveel material. Ferrotec ceramics offer exceptional strength and performance for probe card applications and are ideal for rapid prototyping and accelerating your time to market.

Booth: 302
www.fict-g.com

With over 50 years of industry expertise, FICT has emerged as a prominent supplier of high-end PCBs and IC substrates. Initially established as a Printed Circuit Board (PCB) business unit within a leading Japanese company in the ICT industry, FICT specializes in PCBs crucial for semiconductor test equipment and package substrates essential for safeguarding IC chips. Notably, FICT’s products are utilized in the supercomputer Fugaku, one of the world’s fastest supercomputers, and the company also holds a significant market share in probe card testing (ST Board), ensuring chip integrity.

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Booth: 303
formfactor.com

FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.

By expanding its broad-based test expertise across the design-to-silicon continuum, FormFactor can provide a comprehensive perspective, to become a trusted partner in the semiconductor industry ecosystem.

Booth: 501
www.jfe-shoji-ele.co.jp

Unlock New Dimensions. Create Tomorrow, Today.

We don’t just solve problems; we pioneer the future. From micro-semiconductors to mega-industrial gear, our total solutions are tailor-made to your vision. Experience “Things to Imagine,” brought to life by the synergy of today’s mastery and tomorrow’s tech.

Introducing LEX®: The Alloy That Bends to Your Will.

Choose your perfect match from our expansive LEX® series, offering unparalleled control over thermal expansion – even achieving zero! Need a bespoke CTE design? We craft it. Plus, boost LEX® with custom surface treatments for next-level functionality.

Our Mission: Innovate. Create. Elevate.

We’re relentlessly forging new value through ceaseless development, delivering total solutions that redefine what’s possible.

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Booth: 202
keysight.com

Keysight enables innovators to push the boundaries of engineering by quickly solving design, emulation, and test challenges to create the best product experiences. Through our fusion of technology knowledge, measurement science expertise, and tailored solutions, we deliver intelligent insights throughout the innovation workflow to ensure fast time-to-market with reduced risk.

Booth: 301
www.laserjob.co.jp

From prototype development to mass production, we offer ultra-high precision processing to Probe Card Manufacturers using ultra-short pulsed lasers.

Booth: 216
lincstech.com

On October 1, 2021 the Lincstech Group made a fresh start as an independent manufacturer specializing in printed wiring boards (PWBs).

As the PWB division of Hitachi Chemical and Showa Denko Materials, we have accumulated distinctive and advanced technologies over the past 50 plus years. We have also built connections and trust with our customers by listening to them and proposing solutions to improve the value of their products and services.

Our company name, Lincstech, is a combination of Link + C + Technology. Our company name incorporates our desire to provide value to our customers by using technology to connect the various “Cs” (communication, collaboration, co-creation…) that we consider important.

At Lincstech we are proud that our printed wiring boards assist our customers in realizing superior value in their products and services.

Booth: 212
megatouch.co.kr

Megatouch leads the market in core components for secondary battery and semiconductor testing based on the best technology. We provide optimal products that meet our customers’ needs by independently designing the pins, processing components, conducting plating, and assembly, and establishing a quality evaluation system to ensure perfect quality management. We will continue to grow and advance as a company that is always prepared for the future and leads changes.

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Booth: 404
mjc.co.jp

MJC designs, manufactures, and services advanced technology wafer probe cards: 1TD MEMS, Fine Pitch Vertical, MEMS Spring, for bump, pillar and pad applications. We also produce high performance test sockets for the semiconductor industry.

Booth: 201
mipox.co.jp

Mipox Corporation., a manufacturer of abrasives, will celebrate its 100th anniversary in 2025. Building on a century of extensive manufacturing experience, our cleaning solutions, utilizing a diverse range of abrasives and distinctive film materials, enhance the test reliability of probe cards and sockets, significantly improving product lifespans.

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Booth: 305
mpi-corporation.com

MPI Corporation, established in 1995, is a global leader in advanced probing technology. Committed to innovation, MPI delivers cutting-edge probing solutions that accelerate the evolution of semiconductor technology worldwide.

Booth: 215
www.nidecsvprobe.com

Nidec SV Probe is a global provider of high-quality semiconductor testing solutions. We supply advanced testing products for some of the most complex AI, Mobile, Automotive and IoT devices. Our extensive and diverse product line includes MEMS Probes and MEMS-based probe cards along with a variety of Vertical and Cantilever Probe Card technologies.

Visit us at the Expo to learn more about all our innovative, application-specific solutions!

Booth: 602
neg.co.jp

Uncovering the Unlimited Possibilities of Glass for a Brighter Future

Since our establishment in 1949, Nippon Electric Glass has been at the forefront of glass manufacturing, dedicated to meeting society’s evolving needs.

Guided by a commitment to delivering plentiful high-quality products, we have continuously refined our skills in the creative manufacturing of special glass to drive innovative techniques and shape a brighter future.

Special glass can take on various forms—plates, tubes, fibers, and powders each offering unique properties and functions.

This versatility makes special glass essential for the advancement of many industries, including semiconductors, displays, automotive, information and communications, healthcare, energy, and social infrastructure.

With over 70 years of expertise, our special glass technologies play a crucial role in driving progress across these fields.

Booth: 512
www.oki-otc.jp

OKI Circuit Technology offers the best solution for semiconductor testing boards in PCB design and manufacturing for high multilayer, high-speed and high-frequency supporting from the background the reliable quality of continually evolving semiconductor devices.

Booth: 402
www.oxfordlasers.com

Oxford Lasers is the Home of Laser Innovation since 1977. 

We provide ultra-high precision laser services and systems to advanced manufacturing industries worldwide including probe card companies.  

Our capabilities extend to applications in micromachining, trimming and imaging. Our world-class facility in Oxford, UK supported by our experienced multi-disciplinary team, provides an extensive range of products supporting semiconductor, pharmaceutical, medical technology and aerospace industries.

We excel at micromachining a wide range of materials and features for products such as Guide Plates. Unparalleled in the industry, Oxford Lasers has expertise in laser technologies including applying machine learning into our production process for enhanced performance and pinpoint accuracy.

Booth: 513
pactech.com

PacTech – Packaging Technologies GmbH, established 1995 and a group company of NAGASE & CO., LTD., manufactures equipment for the microelectronic, advanced packaging and wafer probe card industry.

The equipment product line consists of solder jetting equipment (SB2-Jet), laser assisted cantilever/probe assembly (Laplace-Can), wafer-level solder ball transfer systems (Ultra-SB2), wafer-level solder rework equipment (Ultra-SB2 300 WLR), laser assisted (LAB, LCB, LAR) flip-chip bonders (Laplace) and automatic wet chemical lines for high volume electroless NiAu & NiPdAu bumping (PacLine 300 A50).

Those unique and highly innovative manufacturing systems are providing solutions for today’s tasks and challenges in advanced packaging applications.

The wafer level packaging & bumping subcontractor services consist of electroless Ni/Au, Ni/Pd and Ni/Pd/Au Under Bump Metallization (UBM) for either wafer level solder bumping for Flip Chip or WLCSP or for wire bonding. Additionally, PacTech offers AOI, X-Ray, SEM, FIB, BCB Repassivation, wafer-level redistribution, wafer backside metallization, wafer thinning, laser backside marking, wafer dicing and chip singulation.

Booth: 309
pointeng.co.kr

Point Engineering, we specialize in advanced MEMS probe solutions for wafer and package test applications. Our cutting-edge MEMS buckling probes (short length, high CCC), cantilever probes, and fine-pitch spring probes empower customers to push performance boundaries and lead in competitive markets.

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Booth: 406
posalux.com

We are a Swiss machine tools manufacturer offering outstanding micro-machining solutions for mass production since 1943.

Through our mechanical & Femto-LASER technologies, we drill, mill, route, cut & turn polymers, ceramics & precious metals dedicated to Test Equipment applications. Bring a new perspective to your challenges!

Booth: 100
probing.com.cn

Probing is now proudly presenting its Memory Probe Card Test System with ultra-pin-count support up to 300,000 channel testing, including OS/Leakage/TDR, and also with 1000KG chuck force and 3D pin position checker function towards HBM generation probe card testing.

Booth: 205
reidashman.com

Established in 1979 and based in St. George, Utah, Reid-Ashman Manufacturing is a distinguished provider of complete solutions for semiconductor test equipment integration. Our company excels in delivering superior custom engineering designs and manufacturing services, specializing in Test Head Manipulators, Mechanical Docking, and Electrical Interfacing.

Committed to excellence, we prioritize the delivery of exceptional quality across all facets of our products and services. With a global presence, our seasoned team ensures that our solutions adhere to the most rigorous industry standards. At Reid-Ashman Manufacturing, our objective is to consistently lead the market through a commitment to innovation, uncompromising quality, and dedicated responsiveness to our clients’ evolving needs.

Booth: 213
www.semics.com

The culture of SEMICS encourages all challenges, regardless of the result. “SEMICS offers deep trust and high profit to all clients and business partners with the best products made with innovative technologies and challenging results.”

SEMICS has significantly contributed to resolving technical and operational problems in the EDS environment. We believe that our most important task is to be smart to resolve our clients’ biggest concerns.

SEMICS has always brought ‘trust’ to our partners. Offering “trust” is our sacred duty, for which we endeavor to be smarter and friendlier to build stronger solidarity than what SEMICS has accomplished so far.

SEMICS will never be satisfied with present accomplishments in continual pursuit of more contributions to making a better world. SEMICS will remain as the smartest partner who provides the best prober solution in the world.

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Booth: 312
www.star-quest.com

STAr delivers innovative probe card solutions for the most demanding semiconductor testing applications. We excel in SoC IC testing with our Optima MEMS vertical high pin count probe cards (down to 35µm pitch and >2A currents across tri-temperature).

STAr’s one-touch 3D MEMS probe cards significantly lower the Cost-of-Test for Flash memory ICs with single-card tri-temperature testing. For CMOS image sensors (CIS), we offer 3D MEMS probe cards supporting >3.5GSPS C-PHY tests, with next-gen 6GSPS in development.

STAr also introduced Zeus Membrane Probe Cards for signal-critical RF applications, featuring tunable components, adjustable contact force, high channel density, and versatile RF connectors. Additionally, our MEMS WAT probe cards support femto-ampere low-leakage current WAT tests with 35µm pitch capability.

STAr is dedicated to providing our customers with the most advanced and reliable probe card solutions.

Booth: 214
eoulu.com

Established in 2010, Suzhou Eoulu System Integration Co., Ltd. is a high-tech company dedicated to on-chip testing and measurement of semiconductor wafers. It is headquartered in Suzhou Industrial Park. The company has a large number of high-tech talents and has rich experience in the fields of semiconductor and optoelectronic testing.

Its main business includes: sales of components and equipment in the field; wafer-level test integration solutions; self-developed integration software for future series of semiconductor test systems.

Eoulu adheres to high-quality service and grows with customers.

Booth: 218
www.tips.co.at

• Probe Cards for HV/HC power device test (Si, SiC, GaN)
• Known Good Die Test (KGD) for power device (Si, SiC: IGBT, MOSFET, Diode…)
• Probe Cards for Sensors (MEMS, pressure, magnetic, gas, radiation…)
• Vertical Probe Cards for Automotive ASICS, RADAR
• Docking solutions for High Power probe cards (probe card, signal tower, load board suitable for automatic probe card changer)

Booth: 511
technoprobe.com

Innovation Begins with Us

Technoprobe (XMIL: TPRO) is a leading provider of the most advanced wafer test solutions for the semiconductor industry.

The company specializes in design, development, and manufacturing of leading-edge wafer probe cards. Our mission is to be a strategic partner and to be vital to our customers’ overall success. Technoprobe offers a comprehensive product portfolio capable of meeting complex testing requirements and reducing the overall cost of test.

Technoprobe works relentlessly to keep pace with the constant evolution of semiconductors. Our culture to drive Innovation leads us to explore new concepts, to push Technology beyond its limits, and to use customization as a guiding principle to enable the next generation products.

Technoprobe strives to be the technology leader to help build our customers’ future.

Booth: 304
tel.com

Semiconductor Production Equipment. We strive to contribute to the development of a dream-inspiring society through our leading-edge technologies and reliable service and support.

Booth: N/A
www.teraprobe.com

Tera Probe is a leading provider of advanced semiconductor testing solutions. With a commitment to innovation, we specialize in developing cutting-edge technologies for testing of semiconductor devices. We also offer testing solution services such as design and development of probe cards, and development of testing program.

Booth: 401
teradyne.com

Teradyne companies deliver manufacturing automation across industries, applications and the world. Together, we solve complex test and automation challenges and enable businesses to achieve higher production volumes, higher quality and higher ROI.

Booth: 505
relay.com.tw

With over 35 years of engineering excellence, Toward Technologies is a global leader in switching solutions. Our product lineup includes Opto-MOSFET relays, Reed relays, RF MEMS switches, and relay modules, trusted in semiconductor testing, battery management systems (BMS), and energy storage applications.

We specialize in high-speed, high-frequency, precision, and space-optimized switching solutions, engineered to meet the demands of next-generation electronics.

Our customization capabilities span from PCB layout and hardware design to firmware and software development, empowering customers to overcome complex integration challenges and accelerate time-to-market.

Toward Technologies — Enriching Your Design.

Booth: 409
www.turbodynamics.com

Turbodynamics is a driving force in the semiconductor ATE industry, with our high value products  for test cell integration, innovation and automation. 

Leading edge solution provider for

1. Probe card analyzer mother boards,
2. Test cell docking: DD – Pogo Towers – DIB changer mechanism,
3. ATE manipulators,
4. Probe card handling automation and storage.

Booth: 210
withmems.com

WithMEMS Co., Ltd is a MEMS mirco test solution company that specialized in design, development, MEMS fabrication and manufacturing of advanced test solutions for semiconductor probe card, test socket and probe unit for display panel test. The main micro test products and services include Film based probe solutions, 2D MEMS Blade solutions, 2.5 MEMS Pogo solutions (=TRAMS Pogo) with integrated metal housing and spring for fine pitch test solutions. We aim to provide fine-pitch specialized probe, test solutions based on MEMS technology

Booth: 408
yokowo.co.jp/english/

Yokowo proposes a broad spectrum of fine connectors and test systems for front to back-end testing, which excel in signal integrity and are capable of testing the high-speed performance of semiconductors and electronic components amid trends towards higher density, greater integration and higher frequency. With complete before- and after-sales service systems, Yokowo answers the needs of customers.

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Booth: 603
zeroonetest.com

Zero One stands as a preeminent turnkey provider in the ATE interface industry. We deliver an all-encompassing solution for high-quality ATE Board (Device Interface Board). Our offerings are characterized by rapid delivery and cost – effectiveness, covering the entire process from design, simulation, fabrication to component assembly. In addition, we specialize in Vertical Probe Card, handling every aspect from the design and fabrication of Probe Card PCB, MLO design, probe head design to assembly.