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ACCRETECH
Booth: TBD
www.accretech.com
Progressing hand-in-hand with a diverse array of peoples, Tokyo Seimitsu prides itself on its ability to leverage technology, knowledge and information to create the world’s premier products. This unchanging philosophy is personified in our new corporate brand, ACCRETECH. We seek to gather global, cutting-edge technologies across organization, country and region, to overcome challenges and precipitate growth.
Advantest Corporation
Booth: TBD
www.advantest.com
Advantest is the leading manufacturer of automatic test and measurement equipment used in the design and production of semiconductors for applications including 5G communications, the Internet of Things (IoT), autonomous vehicles, high-performance computing (HPC) including artificial intelligence (AI) and machine learning, and more. Its leading-edge systems and products are integrated into the most advanced semiconductor production lines in the world. The company also conducts R&D to address emerging testing challenges and applications; develops advanced test-interface solutions for wafer sort and final test; produces scanning electron microscopes essential to photomask manufacturing; and offers system-level test solutions and other test-related accessories. Founded in Tokyo in 1954, Advantest is a global company with facilities around the world and an international commitment to sustainable practices and social responsibility. More information is available at www.advantest.com.
Celadon Systems, Inc.
Booth: TBD
celadonsystems.com
Celadon Systems is committed to providing reliable and innovative probe cards to meet the most rigorous demands of the semiconductor, medical, quantum computing, space and defense industries. Celadon’s probe cards are engineered to excel in extreme temperature conditions from below 2 Kelvin to over 800C. Specializing in modular and adjustable solutions for MRAM, SiPh/PIC, WLBI, and High Voltage testing, Celadon takes pride in offering the lowest cost of test in the industry with customers achieving millions of touchdowns in both labs and production fabs.
ELSPES
Booth: TBD
elspes.com
The Leading Company in Next Generation Passive Devices
Ferrotec Material Technologies Corporation
Booth: TBD
ft-mt.co.jp
Ferrotec is a world leader in advanced material, component, and system solutions. Ferrotec offers machinable ceramics and ceramic components manufactured using our advanced Photoveel material. Ferrotec ceramics offer exceptional strength and performance for probe card applications and are ideal for rapid prototyping and accelerating your time to market.
FICT LIMITED
Booth: TBD
www.fict-g.com
With over 50 years of industry expertise, FICT has emerged as a prominent supplier of high-end PCBs and IC substrates. Initially established as a Printed Circuit Board (PCB) business unit within a leading Japanese company in the ICT industry, FICT specializes in PCBs crucial for semiconductor test equipment and package substrates essential for safeguarding IC chips. Notably, FICT’s products are utilized in the supercomputer Fugaku, one of the world’s fastest supercomputers, and the company also holds a significant market share in probe card testing (ST Board), ensuring chip integrity.
FormFactor, Inc.
Booth: TBD
formfactor.com
FormFactor, Inc. (NASDAQ:FORM) is a leading provider of essential test and measurement technologies along the full IC life cycle – from characterization, modeling, reliability, and design de-bug, to qualification and production test.
By expanding its broad-based test expertise across the design-to-silicon continuum, FormFactor can provide a comprehensive perspective, to become a trusted partner in the semiconductor industry ecosystem.
Gel-Pak
Booth: TBD
gelpak.com
For over 40 years, Gel-Pak®, a division of Delphon, has been a leading manufacturer of elastomer-based device carriers and films extensively used in semiconductor applications. Our carriers secure semiconductor components during shipping and internal processing, while the proprietary film products serve a wide range of applications including fixturing and surface protection. We also offer the Gel-Probe™ line of probe tip cleaning and polishing wafers and sheets, which are proven to enhance operational efficiency and improve wafer yield. The Gel-Probe ReFine, ReMove, and ReCover products offer solutions for cleaning, polishing, and reshaping probe tips using proprietary abrasive and non-abrasive elastomers. We continue to innovate in partnership with some of the world’s leading probe card manufacturers to develop probe cleaning technologies for next-generation applications
Heraeus Precious Metals GmbH & Co. KG
Booth: TBD
www.herae.us/probing
Heraeus Precious Metals is globally leading in the precious metals industry. For the use of probe cards and the wafer test industry, the product range comprises a variety of alloys for the production of cantilever needles, elements for vertical probing and further interfaces for carrying high currents, offering good signal-to-noise ratio and/or withstand corrosion effects strongly. The company is part of the Heraeus Group and covers the value chain from trading to precious metals products to recycling. It has extensive expertise in all platinum group metals as well as gold and silver.
inTEST EMS
Booth: TBD
www.intest-ems.com
inTEST EMS designs, manufactures, and markets products that are used by semiconductor manufacturers to test their integrated circuits and wafer products. Since 1981, inTEST EMS solutions have grown to include test head manipulators, docking hardware, and test interfaces that enable automated test systems and device handling equipment to connect with accuracy, repeatability and safety with industry best ease of operation. Serving end-user and OEM customers through a worldwide network of sales and service.
IWIN Co., Ltd.
Booth: TBD
www.iwinsn.com
IWIN Co., Ltd. develops Board to Board connecting interposer for Probe card and Test equipment for the post processes of semiconductors with progressive stamping technology. We offer products of the best correspondence and the top quality for customer needs with competitive price.
Japan Electronic Materials Corporation
Booth: TBD
jem-net.co.jp
Japan Electronic Materials Corporation is a worldwide leader in probe card R&D and manufacturing. For over 30 years, JEM is a supplier of technically advanced, high-quality probe cards and tester interfaces. With the power of MEMS probe card, we can meet the requirements in several key areas, including high pin count, hybrid and automotive solutions.
Corporate Mission
It is JEM’s mission to contribute to quality life of people by providing advanced technical products and worldwide services of the highest quality and value. We will strive to exceed our customers’ expectations in order to build long-term relationships.
Keysight Technologies International Japan
Booth: TBD
keysight.com
Keysight enables innovators to push the boundaries of engineering by quickly solving design, emulation, and test challenges to create the best product experiences. Through our fusion of technology knowledge, measurement science expertise, and tailored solutions, we deliver intelligent insights throughout the innovation workflow to ensure fast time-to-market with reduced risk.
Laser Job Inc.
Booth: TBD
www.laserjob.co.jp
From prototype development to mass production, we offer ultra-high precision processing to Probe Card Manufacturers using ultra-short pulsed lasers.
Lincstech Co., Ltd.
Booth: TBD
lincstech.com
On October 1, 2021 the Lincstech Group made a fresh start as an independent manufacturer specializing in printed wiring boards (PWBs).
As the PWB division of Hitachi Chemical and Showa Denko Materials, we have accumulated distinctive and advanced technologies over the past 50 plus years. We have also built connections and trust with our customers by listening to them and proposing solutions to improve the value of their products and services.
Our company name, Lincstech, is a combination of Link + C + Technology. Our company name incorporates our desire to provide value to our customers by using technology to connect the various “Cs” (communication, collaboration, co-creation…) that we consider important.
At Lincstech we are proud that our printed wiring boards assist our customers in realizing superior value in their products and services.
Megatouch Co., Ltd.
Booth: TBD
megatouch.co.kr
Megatouch leads the market in core components for secondary battery and semiconductor testing based on the best technology. We provide optimal products that meet our customers’ needs by independently designing the pins, processing components, conducting plating, and assembly, and establishing a quality evaluation system to ensure perfect quality management. We will continue to grow and advance as a company that is always prepared for the future and leads changes.
Micronics Japan Co., Ltd.
Booth: TBD
mjc.co.jp
MJC designs, manufactures, and services advanced technology wafer probe cards: 1TD MEMS, Fine Pitch Vertical, MEMS Spring, for bump, pillar and pad applications. We also produce high performance test sockets for the semiconductor industry.
MPI Corporation
Booth: TBD
mpi-corporation.com
MPI Corporation, established in 1995, is a global leader in advanced probing technology. Committed to innovation, MPI delivers cutting-edge probing solutions that accelerate the evolution of semiconductor technology worldwide.
OKI Circuit Technology Co., Ltd.
Booth: TBD
www.oki-otc.jp
OKI Circuit Technology offers the best solution for semiconductor testing boards in PCB design and manufacturing for high multilayer, high-speed and high-frequency supporting from the background the reliable quality of continually evolving semiconductor devices.
Oxford Lasers Ltd.
Booth: TBD
www.oxfordlasers.com
Oxford Lasers is the Home of Laser Innovation since 1977.
We provide ultra-high precision laser services and systems to advanced manufacturing industries worldwide including probe card companies.
Our capabilities extend to applications in micromachining, trimming and imaging. Our world-class facility in Oxford, UK supported by our experienced multi-disciplinary team, provides an extensive range of products supporting semiconductor, pharmaceutical, medical technology and aerospace industries.
We excel at micromachining a wide range of materials and features for products such as Guide Plates. Unparalleled in the industry, Oxford Lasers has expertise in laser technologies including applying machine learning into our production process for enhanced performance and pinpoint accuracy.
PacTech – Packaging Technologies GmbH
Booth: TBD
pactech.com
PacTech – Packaging Technologies GmbH, established 1995 and a group company of NAGASE & CO., LTD., manufactures equipment for the microelectronic, advanced packaging and wafer probe card industry. The equipment product line consists of solder jetting equipment (SB2-Jet), laser assisted cantilever/probe assembly (Laplace-Can), wafer-level solder ball transfer systems (Ultra-SB2), wafer-level solder rework equipment (Ultra-SB2 300 WLR), laser assisted (LAB, LCB, LAR) flip-chip bonders (Laplace) and automatic wet chemical lines for high volume electroless NiAu & NiPdAu bumping (PacLine 300 A50). Those unique and highly innovative manufacturing systems are providing solutions for today’s tasks and challenges in advanced packaging applications. The wafer level packaging & bumping subcontractor services consist of electroless Ni/Au, Ni/Pd and Ni/Pd/Au Under Bump Metallization (UBM) for either wafer level solder bumping for Flip Chip or WLCSP or for wire bonding. Additionally, PacTech offers AOI, X-Ray, SEM, FIB, BCB Repassivation, wafer-level redistribution, wafer backside metallization, wafer thinning, laser backside marking, wafer dicing and chip singulation.
Point Engineering
Booth: TBD
pointeng.co.kr
Point Engineering, we specialize in advanced MEMS probe solutions for wafer and package test applications. Our cutting-edge MEMS buckling probes (short length, high CCC), cantilever probes, and fine-pitch spring probes empower customers to push performance boundaries and lead in competitive markets.
Posalux SA
Booth: TBD
posalux.com
We are a Swiss machine tools manufacturer offering outstanding micro-machining solutions for mass production since 1943. Through our mechanical & Femto-LASER technologies, we drill, mill, route, cut & turn polymers, ceramics & precious metals dedicated to Test Equipment applications. Bring a new perspective to your challenges!
Samtec
Booth: TBD
samtec.com
Founded in 1976, Samtec is much more than just another connector company. We put people first, along with a commitment to exceptional service, quality products, and innovative technologies that take the industry further faster. This is enabled by our unique, fully integrated business model, which allows for true collaboration and innovation without the limits of traditional business models.
SandTek US Inc
Booth: TBD
www.sandtekcorp.com
SandTek is a test solutions provider specializing in ATE product development, test cell integration, application, and consulting services.
SEMICS Inc.
Booth: TBD
www.semics.com
The culture of SEMICS encourages all challenges, regardless of the result. “SEMICS offers deep trust and high profit to all clients and business partners with the best products made with innovative technologies and challenging results.”
SEMICS has significantly contributed to resolving technical and operational problems in the EDS environment. We believe that our most important task is to be smart to resolve our clients’ biggest concerns.
SEMICS has always brought ‘trust’ to our partners. Offering “trust” is our sacred duty, for which we endeavor to be smarter and friendlier to build stronger solidarity than what SEMICS has accomplished so far.
SEMICS will never be satisfied with present accomplishments in continual pursuit of more contributions to making a better world. SEMICS will remain as the smartest partner who provides the best prober solution in the world.
STAr Technologies, Inc.
Booth: TBD
www.star-quest.com
STAr enables SoC ICs testing with MEMS vertical, high pin count probe cards down to 35um pitch and >2A driving current over tri-temperature. Our one-touch 3D MEMS micro-cantilever probe cards can significantly lower Cost-of-Test for Flash memory ICs by enabling tri-temperature tests with just one probe card. In addition, STAr supplies MEMS probe cards to CMOS image sensor (CIS) customers with C-PHY tests at >3.5GSPS and with next generation 6GSPS in development. STAr’s MEMS probe cards enables WAT tests for femto-ampere low-leakage current tests and 35um-pitch requirements.
Suzhou Eoulu System Integration Co., Ltd.
Booth: TBD
eoulu.com
Established in 2010, Suzhou Eoulu System Integration Co., Ltd. is a high-tech company dedicated to on-chip testing and measurement of semiconductor wafers. It is headquartered in Suzhou Industrial Park. The company has a large number of high-tech talents and has rich experience in the fields of semiconductor and optoelectronic testing. Its main business includes: sales of components and equipment in the field; wafer-level test integration solutions; self-developed integration software for future series of semiconductor test systems. Eoulu adheres to high-quality service and grows with customers.
TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd.
Booth: TBD
tanaka-preciousmetals.com/en/
Since its foundation in 1885, TANAKA Precious Metals has built a diversified range of business activities focused on precious metals. Precious metals are used as various industrial materials by taking advantage of their unique properties, and the semiconductor test field is one of them. We make a wide variety of precious metal materials such as Wire / Sheet / Plating solution used for Probe Pin and Contact Probe materials used in semiconductor test. We can meet diversifying needs by utilizing precious metal material melting technology and processing technology cultivated over many years.
Teradyne K.K.
Booth: TBD
teradyne.com
Teradyne companies deliver manufacturing automation across industries, applications and the world. Together, we solve complex test and automation challenges and enable businesses to achieve higher production volumes, higher quality and higher ROI.
T.I.P.S. Messtechnik GmbH
Booth: TBD
www.tips.co.at
- Probe Cards for HV/HC power device test (Si, SiC, GaN)
- Known Good Die Test (KGD) for power device (Si, SiC: IGBT, MOSFET, Diode…)
- Probe Cards for Sensors (MEMS, pressure, magnetic, gas, radiation…)
- Vertical Probe Cards for Automotive ASICS, RADAR
- Docking solutions for High Power probe cards (probe card, signal tower, load board suitable for automatic probe card changer)
The 2025 Exhibitor Listing will be updated starting in May 2025
Thank you to our 2024 Exhibitors listed below!
Chroma ATE, Inc.
Booth: 218
ChromaUS.com
Founded in 1984, Chroma ATE Inc. is a world-leading supplier of precision test and measurement instrumentation, automated test systems, intelligent manufacturing systems, and test & automation turnkey solutions marketed globally under the brand name “Chroma”. Significant markets served by Chroma include semiconductors, photonics, LED, photovoltaics, video & color, flat panel displays, power electronics, passive components, electrical safety, green batteries, electric vehicles, thermoelectrics, automated optical inspection and intelligent manufacturing systems for ICT and cleantech industries. At Chroma, we believe in the truth of measurements and the trust of partnerships. Using the most advanced solutions, we test and measure the quality of clients’ products to make them better, more effective, and ultimately thriving in the marketplace. By delivering truth in constructive, open, and trusted partnerships, we enable the development of innovative products for the betterment of society and the world.
Entegris
Booth: 508
Entegris.com
Entegris, Inc. (NASDAQ: ENTG) is a world-class supplier of advanced materials and process solutions for the semiconductor, life sciences, and other high-tech industries. For over 50 years, we have been committed to solving our customers’ most demanding process challenges through a broad solutions portfolio, collaborative and innovative product development, and a focus on science and applications knowledge. Entegris has ~9,000 employees throughout its throughout its global operations and is ISO 9001 certified. It has manufacturing, customer service, and/or research facilities throughout United States, Canada, China, France, Germany, Israel, Japan, Malaysia, Singapore, South Korea, Taiwan and the United Kingdom. Our highly skilled team members, facilities and resources are right where you need them in order to help you solve your most advanced technology challenges.
ERS electronic GmbH
Booth: 301
ers-gmbh.com
ERS electronic GmbH, based in the Munich suburb of Germering, has been providing innovative thermal management solutions to the semiconductor industry for more than 50 years. The company has gained an outstanding reputation, notably with its fast and accurate air cooling-based thermal chuck systems for test temperatures ranging from -65 °C to +550 °C for analytical, parameter-related and manufacturing probing. In 2008, ERS extended its expertise to the Advanced Packaging market. Today, their fully automatic and manual debonding and warpage adjust systems can be found on the production floors of most semiconductor manufacturers and OSATs worldwide. The company has received widespread recognition in the industry for their ability to tackle complex warpage issues that arise in the Fan-out wafer-level packaging manufacturing process.
Fukuoka Prefectural Government
Booth: 113/114
www.kigyorichi.pref.fukuoka.lg.jp
Fukuoka Prefecture has flourished as the “gateway to Asia” since ancient times, as it is located close to the Asian continent in Japan. Fukuoka Airport has routes to 21 cities, and for example, it takes about 2.5 hours to get to Taipei, so its strength is its proximity to Asian countries.
Fukuoka Prefecture has a thriving semiconductor industry, with approximately 400 semiconductor-related companies with excellent technological capabilities, including world-class companies in each semiconductor field. In addition, there are many public support organizations that support corporate research and development, as well as educational institutions such as universities and technical colleges. At our booth, distinctive companies from Fukuoka Prefecture are exhibiting. Please stop by our booth.
Hioki E.E. Corporation
Booth: 513
www.hioki.com
Hioki has pursued unique technologies over its history so that it can provide new value to customers through high-quality products. For about 40 years after our founding in 1935, our business centered on volume production of meters and testers. Starting in 1974, we modernized our management and pursued an aggressive R&D program that yielded today’s four product groups. The result has been a distinctive portfolio that includes no-metal-contact voltage measurement technology, high-sensitivity current measurement technology, and other innovative technologies. Going forward, we will continue to embrace the challenge of uniqueness so that we can leverage our accumulated expertise to further improve technologies in areas such as sensing, high-frequency measurement, and electrochemistry; create new tentpole product groups; and contribute to society.
JFE Shoji Electronics Corporation
Booth: 501
www.jfe-shoji-ele.co.jp
Creating New Value with Unceasing Development Our mission is to offer the total solution that is the most suitable for customers through the understanding of their problems using our product lineups from small-scale semiconductor to large-scale industrial equipment. “Thing to Imagine” is created by our full-scale solution with the technology of “Now and Future”.
Mipox Corporation
Booth: 213
mipox.co.jp
Mipox combines our core technologies of coating, slitting, and polishing to provide products and services that create added value for our customers’ success. We manufacture consumable items such as polishing films and liquid polishing agents for rough polishing processing of products including aircraft, ships, automobile bodies, woodworking components for musical instruments and building materials, as well as for high-tech fields such as hard disks, optical fibers, and semiconductors that require high-precision polishing performance. We also develop and sell polishing equipment for using these polishing materials, as well as observation equipment for inspecting the polishing accuracy. In addition, we manufacture and sell reflective products under the brand name RefLite, which are created through the combination of our “coating” and “slitting” technologies.
Mitsubishi Gas Chemical Company, Inc.
Booth: 207
ipros.jp/catalog
Mitsubishi Gas Chemical continues to provide the semiconductor industry with high-quality and innovative products, leveraging our exceptional research and development capabilities and advanced manufacturing technologies. Through close collaboration with our customers, we swiftly respond to market changes and develop new solutions that lead the industry. Recently, Mitsubishi Gas Chemical has commenced the provision of new polyimide substrates suitable for fine processing for test sockets, probe cards, and MEMS. We have also developed conductive and low-dielectric grades. As a partner supporting the future of the semiconductor industry, Mitsubishi Gas Chemical will continue to strive for sustainable technological innovation.
NAGASE & Co., Ltd.
Booth: 201
nagase.co.jp
NAGASE & CO., LTD. is a chemicals trading firm, founded in Kyoto, Japan in 1832. The NAGASE Group began as a specialized sales agent securing exclusive contracts to sell industry-leading products from around the world in Japan. Over the years, we have leveraged our technology and information gathering expertise —as well as our global network—to transform our business into a hybrid model offering superior manufacturing, processing, and R&D functions as well as trading company services. Looking forward to our 200th anniversary in the year 2032, we will contribute to the society as a Business Designer that creates a sustainable future.
Nidec SV Probe, Inc.
Booth: 215
www.nidecsvprobe.com
Nidec SV Probe is a leading provider of high-quality semiconductor testing solutions. With a diverse product line that includes MEMSFlex™, a range of customizable MEMS probes/probe cards and a variety of other probe card technologies, we supply advanced testing products for some of the most complex RF, 5G, Mobile, Automotive and IoT devices. Nidec SV Probe’s unmatched manufacturing and support infrastructure provides coverage for major semiconductor regions across the globe. We have full design and manufacturing capabilities in the USA, China, Japan, Taiwan and Singapore.
Nippon Electric Glass Co., Ltd.
Booth: 311
neg.co.jp
NEG was founded over half a century ago, in 1949. In the intervening years, the company has consistently focused on developing and improving its glassmaking technology and introducing new products. NEG has always been committed to creating and refining its technology. In addition to the production facilities in Japan that constitute its core base, NEG has established plants overseas to meet global needs. The company has also been transforming its business structure in order to adapt to new market conditions. NEG will continue to draw on its extensive expertise and seek to manufacture products of the highest standards.
Qualmax Inc.
Booth: 509
www.qualmax.com
We contribute to our customer’s success by being a world-class provider of innovative Semiconductor Test Hardware including Spring Probes (pogo-pins), Probehead, Test Sockets, Change Kit, Pogo Tower, Stiffener, Interposer Blocks and Other test related hardware.
We offer turn-key service to our customers, Probehead, Probes from design, manufacturing to outgoing inspection, all process in house.
Reid-Ashman Manufacturing
Booth: 302
reidashman.com
Established in 1979 and based in St. George, Utah, Reid-Ashman Manufacturing is a distinguished provider of complete solutions for semiconductor test equipment integration. Our company excels in delivering superior custom engineering designs and manufacturing services, specializing in Test Head Manipulators, Mechanical Docking, and Electrical Interfacing. Committed to excellence, we prioritize the delivery of exceptional quality across all facets of our products and services. With a global presence, our seasoned team ensures that our solutions adhere to the most rigorous industry standards. At Reid-Ashman Manufacturing, our objective is to consistently lead the market through a commitment to innovation, uncompromising quality, and dedicated responsiveness to our clients’ evolving needs.
Santec
Booth: 414
www.santec.com
Santec Holdings Corporation (“Santec”) was established in 1979 and is listed on the Standard Market (6777), a section of the Tokyo Stock Exchange. It is headquartered in Komaki, Aichi, Japan and has subsidiaries in Japan, North America, Europe and China. Santec serves a global customer base; including the world’s major semiconductor and silicon photonics companies, internationally recognized research centers and universities. Santec’s product lines include a broad range of advanced optical components, medical devices, and test/measurement equipment suited in particular to advanced silicon wafer research and manufacturing.
SANYU SWITCH Co., Ltd.
Booth: 507
www.sanyu.co.jp
The establishment of our company is 1972. Since our founding, we have designed and manufactured mainly reed relays. Recently, we have designed and manufactured test sockets in addition to reed relays. They are mainly used in the development and testing of semiconductors.
SEMCNS Co., Ltd.
Booth: 502
www.semcns.com
Launched as SEMCNS Co., Ltd in 2016, we are the only company in the world to supply ceramic LTCC STF as a company that produces ceramic STF (Space Transformer), a key component of EDS (Electric Die Sorting) semiconductor test process during semiconductor wafer process. For the first time in the world, LTCC-based ceramic STF has been commercialized, and it has developed its own technology throughout the entire process from materials to commercialization, and has 89 patents. In addition, we have secured global customers such as Samsung Electronics, SK Hynix, Micron, and Kioxia to supply products. In Korea, it is NO.1 in the field of ceramic STF, and it is the only one in the world that has developed LTCC-based large-area shrinkage compensating control technology.
Technoprobe
Booth: 512
technoprobe.com
Innovation Begins with Us
Technoprobe (XMIL: TPRO) is a leading provider of the most advanced wafer test solutions for the semiconductor industry.
The company specializes in design, development, and manufacturing of leading-edge wafer probe cards. Our mission is to be a strategic partner and to be vital to our customers’ overall success. Technoprobe offers a comprehensive product portfolio capable of meeting complex testing requirements and reducing the overall cost of test.
Technoprobe works relentlessly to keep pace with the constant evolution of semiconductors. Our culture to drive Innovation leads us to explore new concepts, to push Technology beyond its limits, and to use customization as a guiding principle to enable the next generation products.
Technoprobe strives to be the technology leader to help build our customers’ future.
Tera Probe, Inc.
Booth: 406
www.teraprobe.com
Tera Probe is a leading provider of advanced semiconductor testing solutions. With a commitment to innovation, we specialize in developing cutting-edge technologies for testing of semiconductor devices. We also offer testing solution services such as design and development of probe cards, and development of testing program.
Tokyo Electron Limited
Booth: 304
tel.co.jp
TEL are a leading global company of innovative semiconductor production equipment.
Turbodynamics GmbH
Booth: 412
www.turbodynamics.com
Revolutionising Test Cell Integration by Automation Turbodynamics is a driving force in the semiconductor ATE industry, with our high value products for test cell integration, innovation and automation. Our technology leading company is providing innovative solutions for: ATE hard docking for high yielding test cell integration and automation ATE manipulators and trolleys for test floor reduction Automated probe card & load board changers at final test P&P and strip handlers for ergonomic and high yielding quick exchange Automated probe card & load board handling trolleys & storage for semi & fully automated handling Probe Card Analyser Adaptors and Fixtures Final test handler conversion kits for standard, precision & special applications Our Innovation is your success. We are looking forward to meet you at the conference.ovative semiconductor production equipment.
UIGREEN Co., Ltd
Booth: 309
uigreen.co.jp
We establish a system that enables to consistently develop and manufacture contact probes and test sockets for higher-frequency and fine pitch with higher pin counts semiconductor testing with excellent cost performance. And we have built a system that enables to provide consistent services from research and development to high volume production.
UNITES Systems a.s.
Booth: 310
unites-systems.com
UNITES Systems a.s. is a private company located in the Czech Republic founded in 1991. Main focus is on development and production of semiconductor testers – ATEs (Automatic Test Equipment), especially for discrete semiconductors (MOSFETs, IGBTs, Diodes, etc.) but also for mixed-signal devices like Analog ICs, PWM, Voltage regulators, etc.
Advanced Probing Systems, Inc.
Booth: 315
AdvancedProbing.com
The World’s Leader in the Manufacture of Probes Used in Cantilever Wafer Test, LED and LCD Testing. Advanced Probing Systems can produce custom pins for your test applications in tungsten, tungsten-rhenium, berylliumcopper, palladium alloys and NewTek™, APS’s proprietary non-oxidizing material. Lower your overall cost of testing by using APS’s quality probe needles.
Contact:
Edward Johnson | ejohnson@advancedprobing.com
465 S. Pierce Avenue #200, Louisville, CO 80027 USA
+1-303-939-9384
Bright Toward Ind., Co., Ltd.
Booth: TBD
www.relay.com.tw
Bright Toward Industrial Co., Ltd (TOWARD RELAYS as a brand ) has been a manufacturer of Solid State Relays, Opto-MOSFET Relays, Opto- SiC MOSFET Relays, Reed Relays, Wet Reed Relays, and RF MEMS Switches since 1988.
We have been supplying the world’s semiconductor testing, Battery Management Systems (BMS), Automatic Test Equipment (ATE), Industrial Control, and Telecommunication Industries for over three decades.
As of 2021, our annual revenue is USD 50million, with factories located in Hsinchu, Taiwan, and Zhejiang, China. Worldwide sales offices are located in Singapore, Germany, San Jose, Rhode Island, Beijing, Shenzhen, Suzhou, and Taipei.
Caliber Interconnects Private Limited
Booth: 503
www.caliberinterconnect.com
Greetings from Caliber Interconnects! We have been serving the semiconductor industry for the past 20+ years providing IC testing and its allied Services including SI/PI, Hardware development, Packaging design.
Chain-Logic International Corp.
Booth: 221
cli.com.tw
Chain Logic International Corp. (CLIC) established in 1994 was located in Hsinchu Taiwan, and our mother company is MPI Corporation which was IPO since 2003. CLIC is a professional agent in Taiwan and provides technical support, service for the manufacturing of high-tech industries such as Semiconductor, Optical devices, PCB, discrete devices and etc. sectors.
Chunghwa Precision Test Tech. Co., Ltd. (CHPT)
Booth: 207
CHT-PT.com.tw
Chunghwa Precision Test Tech. Co., Ltd. (CHPT) was founded on Aug. 26, 2005. It was located in Pingzhen Industrial Park, Taoyuan City. CHPT was the high-speed PCB team in the Chunghwa Telecom Laboratories. We have been focusing on the interface board services required for testing in the semiconductor industry since 2001. Our primary products are Load Board for IC test, probe PCB for wafer test, substrate for vertical probe card and DUT board for memory test.
esmo Taiwan Co., Ltd
Booth: 214
esmo-group.com
Established in 2001, esmo group is an international enterprise that provides innovative and advanced engineering solutions to the semiconductor test industry. esmo Semicon is a leading worldwide supplier of handler, manipulators, docking, and interface systems. With strategically located facilities in Germany, China, Southeast Asia, USA and Taiwan.
Our strong portfolio of leading-edge technology, state-of-the-art machinery, and innovative production engineering allows us to meet the most challenging requirements with competence and competitiveness.
Contact:
Caroline Lin | caroline.lin@esmo-asia.com
9F., No. 247, Dong Sec. 1, Guangming 6th Rd., Zhubei City, TW-HSQ 302044, Taiwan
+886-3-550-5102
Exaddon AG
Booth: 215
www.exaddon.com
Exaddon’s template-free 3D printing technology prints high conductivity metal with micrometer resolution.
We have transitioned from fundamental research applications to semiconductor testing, 3D printing probes directly on customizable and exchangeable space transformers at pitches of less than 20 µm.
This unique method cuts cost and complexity, and offers unparalleled possibilities in customization, pitch, and lead time.
Feinmetall GmbH
Booth: 202
www.feinmetall.com
Since 1964 FEINMETALL GmbH is a leading company for spring contact probes and wafer probe cards. Our passion is to develop and manufacture contacting solutions for testing electrical and electronic components. Our products are being used in the semiconductor, electrical and electronic and automotive industry, and in many other segments.
It does not matter where in this world test jobs need to be mastered, there is a good chance that FEINMETALL is just around the corner. We always have a finger on the pulse of the market and are available to our customers on site with many locations in America, Asia and Europe.
Our solutions include vertical probe cards, probe cards for pads and copper pillars, probe cards for WLCSP, SiP analog and mixed signal flip chip applications as well as Cantilever probe cards.
Even for the most difficult contact-making tasks, highly specialized development and engineering teams we find the best possible solutions for our customers.
Hermes Testing Solutions Inc.
Booth: 512
www.hermes-testing.com.tw
Hermes Testing Solution Inc. has grown together with semiconductor testing industry for decades. We provide thorough services and technical supports, including Probe Card/ Load board design, equipment service and customized products development. Comprehensive testing solutions ensure that our customers maximized their benefit.
Integrated Technology Corp.
Booth: 507
IntTechCorp.com
The Ideal Probe Card Analyzers
Integrated Technology Corporation has been serving the needs of our customers since 1975.
We provide solutions for metrology and testing equipment in many areas:
The ITC line of Probilt, probe card analyzers provide fast, accurate and repeatable test data for all types of probe card technologies. Simple user definable vision parameters allow even the newest and most complex probe tips to be captured and accurately measured.
JTT Test Solutions Partner Co., Ltd
Booth: 503
JT-Tech.com
Contact:
黃品岳 (Pin-yueh, Huang) | jtt51@jt-tech.com.tw
5F-1, No. 31, Huanke 1st Rd., Zhubei City, Hsinchu County 302047, Zhubei, 302047 Taiwan
+886-09-379-16891
Onto Innovation
Booth: 102
OntoInnovation.com
Onto Innovation is a leader in process control with leading-edge technologies that include: Unpatterned wafer quality; 3D metrology spanning chip features from nanometer scale transistors to large die interconnects; macro defect inspection of wafers and packages; elemental layer composition; overlay metrology; factory analytics; and lithography for advanced semiconductor packaging.
Contact:
Danny Chen | danny.chen@ontoinnovation.com
16 Jospin Road, Wilmington, MA 01887 USA
+1-415-902-7065
PTSL
Booth: 112
probetestsolutions.com
Probe Test Solutions Limited (PTSL) delivers world leading ATE test hardware to blue-chip customers around the globe, including the highest frequency 120GHz RF Probe Card Solutions. Our team has a proven record of pioneering innovative technology that solves the most complex industry challenges.
SPEA S.p.A.
Booth: 203
SPEA.com
Established in 1976, SPEA is a world leader in the field of automatic test equipment for semiconductors and electronic boards. Product portfolio includes:
- Automated test cells for MEMS devices, combining handling, testing, and physical stimulus for single-function or COMBI MEMS;
- Analog Mixed-Signal semiconductor testers;
- Test Cells for Power Modules, MOS, IGBT;
- Double-sided Wafer Prober and Tester;
- Flying Probe Testers, for testing PCBs, probe cards, load boards
- In-Circuit Board Testers, offering highest throughput
Contact:
Elia Petrogalli | elia.petrogalli@spea.com
Via Torino, 16 Volpiano, 10088, Italy
+39-0119-825948
Sung Han Co., Ltd
Booth: 502
SungHan.com.tw
We focuses on the global supplier of “Vertical probe card” and “Light Source” for image sensor testing. We provides solutions for different product (ex: 12 inch or 8inch chip testing, Final test… etc)
We continue to develop new technology for customer to provide the latest manufacturing processes and provide customers with the best products and services. The main service industries CIS, fingerprint, TOF … etc.
Zhejiang Goldlink Tech Co.,Ltd
Booth: 501
www.goldlink-tech.com
Goldlink specializes in producing precision semiconductor test probe parts. Since 2017, it has established the first domestic production base specializing in the production of semiconductor test probe parts in Jiaxing , Zhejiang, China. It has become the preferred supplier of the world’s top semiconductor test equipment enterprises with the world’s leading product quality.
The company has 223 sets of the most advanced precision CNC machines, a full set of post-processing and inspection equipments, and produces 15 million pieces of probe parts per month,and will reach 323 sets of CNC machines for probe parts in Oct. 2023. Goldlink plans to reach 400 CNC machines within 3 years, with a monthly capacity of over 40 million pieces.
The company provides various parts such as Top plunger, Bottom plunger, Barrel and Insulator for semiconductor test probes, as well as Heat treatment and Plating, especially specializes in micro-probes of Palladium Alloy, Beryllium copper and PTFE insulators.
