SWTest Asia has SOLD OUT!
We have reached our maximum registration capacity and all deadlines have passed. We can no longer accept new registrations or substitutions. No on-site registrations will be accepted.
定員に達しましたので受付を終了させていただきました。心より感謝申し上げます。
現地会場での参加登録はお受けできませんのでご了承ください。
The 2025 program will be updated with more details in August 2025.
Last updated:
Schedule-At-A-Glance
subject to change
For details on the schedule for the 5th Annual Golf Tournament on Saturday, November 22, please visit the golf webpage.
Attendee Registration Check-In will be from 8:00 to 17:00 on both Thursday and Friday.
Thursday, November 20
Friday, November 21
Detailed Technical Session Schedule
Thursday, November 20
Time | Event |
|---|---|
| 8:45 – 9:00 | Welcome Address for SWTest Asia 2023 Jerry BROZ, PhD, SWTest General Chair (Delphon – USA) |
| 9:00 – 10:00 |  KEYNOTE 1Advanced Electronic Heterogeneous Integration and Testing Wei-Chung LO, PhD Deputy General Director Electronic and Optoelectronic System Research Laboratories (EOSL) Industrial Technology Research Institute (ITRI) |
| 10:00 – 10:30 | Tea Break in EXPO Hall |
| 10:30 – 12:00 | Technical Session 1: New Probe MFG Session Chair: Eric CHIA-CHANG (Intel – USA) |
| 10:30 – 11:00 | Characteristics of The New Pd-based Alloy for Probe-pins, TK-FS, which has three unique features: High Hardness/High Electrical Conductivity/High Ductility Takeshi FUSE, Kunihiro SHIMA, and Takeyuki SAGAE (TANAKA KIKINZOKU KOGYO K.K. -Japan) |
| 11:00 – 11:30 | Application of MD (Molecular Dynamics) methodology in the development and verification of advanced MEMS materials for future wafer probe cards Young Jun PARK, Jin-Wook JANG, Sang Dan KIM, Song Ho KIM, In Suk LEE, Joon Young CHOI (Korea Instrument – South Korea), Changhyun CHO, Joonyeon KIM (Samsung Electronics – South Korea) |
| 11:30 – 12:00 | Cutting Cost and Resolution Enabled by Novel Photonic Technologies for Next-Generation Probe Cards Manufacturing Ksenija VARGA and Thomas UHRMANN (EV Group – Austria) |
| 12:00 – 14:00 | LUNCH (Tech Showcase 1 – 3) |
| 14:00 – 15:30 | Technical Session 2: Electrical Challenge Session Chair: Alan FERGUSON (Oxford Lasers – UK) |
| 14:00 – 14:30 | Contact Resistance Application in Parametric Testing Iwan KURNIAWAN, Kar Loong LOW and Thiam Seng YIP (Micron Semiconductor Asia Pte. Ltd. – Singapore) |
| 14:30 – 15:00 | SiC, GaN and more: Probing Technologies for HV/HC Power Devices Rainer GAGGL (T.I.P.S. Messtechnik GmbH – Austria) |
| 15:00 – 15:30 | Current Carrying Capacity Maximization in Probe Cards And the Path to An Unburnable Probe Hadi NAJAR (Form Factor Inc. – USA) |
| 15:30 – 16:00 | Tea Break in EXPO Hall (Tech Showcase 4) |
| 16:00 – 17:30 | Technical Session 3: AI in Probing Tech Session Chair: Muru MEYYAPPAN (Marvell Technology – USA) |
| 16:00 – 16:30 | Seamless ATE test program generation using a ML approach – Multi-label classification SenthilKumar DHAMODHARAN, Vaishnavi SARAVANAN, Dinesh ARIVALAGAN, and Lavanya RAJU (Caliber Interconnect Solutions Pvt Ltd – India) |
| 16:30 – 17:00 | Probes Cleaning Effectiveness challenges for fine pitch and high density Logic Probe Cards with MEMS tips Wen Jung CHANG (Micron – Taiwan) |
| 17:00 – 17:30 | Probe Card Maintenance with Artificial Intelligence Assistance System Adolph CHENG, Ying-Jen CHEN and Anthony FAN (MPI Corporation – Taiwan) Jia-Yu PENG and Prof. Chen-Fu CHIEN (AIMS Research Center, NSTC – Taiwan) |
Friday, November 21
Time | Event |
|---|---|
| 8:45 – 9:00 | Friday Program Intro Jerry BROZ, PhD, SWTest General Chair (Delphon – USA) |
| 9:00 – 10:00 |  KEYNOTE 2Wafer in, SSD out – Famous Last Words of a Test engineer to Manufacturing: “Test All Bits!” Pradip GHIMIRE Vice President of Memory Product Solutions Western Digital, Inc. |
| 10:00 – 10:30 | Tea Break in EXPO Hall (Tech Showcase 5) |
| 10:30 – 12:00 | Technical Session 4: Marketing & Innovation Session Chair: Kenny TANG (TSMC Corporation – Taiwan) |
| 10:30 – 11:00 | 3D microprinted probes for testing at sub 20 ¬µm pitch Wabe KOELMANS, Sam LIN, Anita HUANG, Angus WANG, Edgar HEPP, Francesco COLANGELO, Patrik SCHÜRCH (Exaddon AG – Switzerland) |
| 11:00 – 11:30 | Silicon Photonic On-Wafer Test Choon Leong LOU and Ban Ban LIM (STAr Technologies, Inc. – Taiwan), Soon Leng TAN and Wei Liang SIO (CompoundTek Pte Ltd – Singapore) |
| 11:30 – 12:00 | Probe Card Market Dynamics and Cost of Test Analysis Panchami Divakar PHADKE (TechInsights – USA) |
| 12:00 – 14:00 | LUNCH (Tech Showcase 6 – 8) |
14:00 – 15:30 | Technical Session 5: KGD Technology Session Chair: Alex YANG (MPI Corporation – Taiwan) |
| 14:00 – 14:30 | Waveform consideration of shared driver Shoichi MATSUO (Micron Memory Japan Inc. – Japan) |
| 14:30 – 15:00 | AMT 5000: KGD Testing at the Die Level Optimized for HBM Calvin PARK (AMT. CO. LTD. – South Korea) |
| 15:00 – 15:30 | KGD 56G PAM4 High Speed Testing for data center product – Setup Stability Improvement at Wafer Sort Wei Hoong YAP (Marvell Technology Inc. – Singapore) |
| 15:30 – 16:00 | Tea Break in EXPO Hall (Tech Showcase 9) |
16:00 – 17:00 | Technical Session 6: High Speed Challenge Session Chair: Joey WU (SWTest Conference – Taiwan) |
| 16:00 – 16:30 | High Speed Probe Card architecture for High End Devices Alberto BERIZZI, Alice GHIDONI, Xin-Reng FOO, Chee-Hoe LIN, Ivan GIUDICEANDREA, Giancarlo BRIVIO, Raffaele VALLAURI (Technoprobe – Italy) |
| 16:30 – 17:00 | Complex Impedance Matching Structures for Advanced On–Wafer AiP Testing Pratik GHATE (FormFactor, Inc – USA) |
| 17:00 – 17:15 | Awards for Best Presentations Jerry BROZ, PhD, SWTest General Chair (Delphon – USA) |
| 17:15 – 19:15 | Friday Street Food Festival 5 F Chapel+Garden |