SWTest Asia has SOLD OUT!
We have reached our maximum registration capacity and all deadlines have passed. We can no longer accept new registrations or substitutions. No on-site registrations will be accepted.
定員に達しましたので受付を終了させていただきました。心より感謝申し上げます。
現地会場での参加登録はお受けできませんのでご了承ください。
The 2025 program will be updated with more details in August 2025.
Last updated:
Schedule-At-A-Glance
subject to change
For details on the schedule for the 5th Annual Golf Tournament on Saturday, November 22, please visit the golf webpage.
Attendee Registration Check-In will be from 8:00 to 17:00 on both Thursday and Friday.
Thursday, November 20
Friday, November 21
Detailed Technical Session Schedule
Wednesday, November 19
| Time | Event |
|---|---|
| 20:00 – 23:00 | EXPO Move-In/Setup |
Thursday, November 20
| Time | Event |
|---|---|
| 7:30 – 9:30 | EXPO Move-In/Setup |
| 7:30 – 17:00 | Conference Registration Check-In |
| 8:45 – 9:15 |  Welcome to SWTest Asia 2025Jerry BROZ, PhD (SWTest Conference General Chair – USA) |
| 9:15 – 10:00 |  THURSDAY VISIONARY KEYNOTE (more details)Leading edge test technology and strategy for Automotive products Kazuyuki IWAGURO Vice President of HPC Business management and Operations Division (Renesas Electronics Corporation – Japan) |
| 10:00 – 10:30 | Tea Break in EXPO Hall |
| 10:00 – 17:30 | SWTest Asia 2025 EXPO Open |
| 10:30 – 12:00 | Technical Session 1: Enabling HBM Test Session Chair: Eric Chia-Cheng CHANG (Intel – USA) |
| 10:30 – 11:00 |  The emergence of Advanced Memories and its impact on Probe test solutions.Alistair LAING (Micron Technology – USA) |
| 11:00 – 11:30 |  Innovations in Testing for Truly Known Good High Bandwidth Memory StacksAlan LIAO (FormFactor – USA), Hiromitsu TAKASU (Advantest – Japan) |
| 11:30 – 12:00 | Tsung Yi CHEN (MPI Corporation – Taiwan) |
| 12:00 – 14:00 | LUNCH in EXPO Hall |
| 12:25 – 12:45 | Tech Showcase 1 – MPI Corporation Title: TBD |
| 13:25 – 13:45 | Tech Showcase 2 – Micronics Japan Co., Ltd. Title: TBD |
| 14:00 – 15:30 | Technical Session 2: Probe Potpourri Session Chair: Masahide OZAWA (Micronics Japan Co. – Japan) |
| 14:00 – 14:30 |  How AI can reduce cost and extend the lifetime of probe cardsNunzio RENZELLA (Advantest – Italy) |
| 14:30 – 15:00 |  Inrush Current Suppression Technology for Probe Needle ProtectionKenichi TAKANO (Keysight Technologies – Japan) |
| 15:00 – 15:30 |  Innovative Cleaning Wafer Strategies to Enhance Memory Probing EfficiencyVictoria TRAN (Gel-Pak – USA), Keiichi RYU, Miki NOMURA, Tomonao NAKASHIMA (JEM – Japan) |
| 15:30 – 16:00 | Tea Break in EXPO Hall |
| 15:30 – 16:00 | Technical Poster Session |
| 15:35 – 15:55 | Tech Showcase 3 – Form Factor Title: TBD |
| 16:00 – 17:30 | Technical Session 3: Materials Challenges Session Chair: Patrick MUI (JEM America – USA) |
| 16:00 – 16:30 | Georg FRANZ (T.I.P.S. Messtechnik GmbH – Austria) |
| 16:30 – 17:00 | Martin SENZEL, Matthias WEGNER, Nail AKROUTI (Heraeus Precious Metals – Germany) |
| 17:00 – 17:30 |  Development of a High-Hardness Pd Alloy “TK-SK” with Hardness over 600 HV for Pogo Pin ApplicationsKeisuke ODAKURA, Kunihiro SHIMA, Takeshi FUSE, Takeyuki SAGAE (TANAKA PRECIOUS METAL TECHNOLOGIES Co., Ltd. – Japan) |
| 17:30 – 20:00 | Kagamiwari Ceremony & Welcome Reception |
Poster Session
Session Chair: Nyi Nyi THEIN (Western Digital Corporation – Japan)
- Evaluation of Palladium Alloy Probe with Suppressed Sn Diffusion Reaction
Kenichi SATO, Tomohisa HOSHINO, Naohito ODANI (Yokowo Corporation – Japan), Shohji IKUO (Graduate School of Science and Technology, Gunma University – Japan) - Technologies to support data transmission with extremely high frequencies (400G+) on printed circuit boards
Quaid Joher FURNITUREWALA (Advantest America Inc – USA) - High Voltage DUT Power Supply IC for Automotive Grade Testing
Thomas ABIOG (Elevate Semiconductor – USA) - A Modern Low Current, Low Leakage Switch Matrix
Hai DAU, Israel ECHEVARRIA, John WILLIAMSON, Christine BUI (Spire Manufacturing, Inc. – USA) - A POGO-Type MEMS pin for Fine-Pitch Probing
Jong-Uk BU, Ho-Sub BANG, Hwangsub KOO, SangHyeop LEE, Seo KOO, Seokhwan YOO, Youngho NAM (WithMEMS – South Korea) - Probe Card Analyzer Motherboard Flexibility and Performance Improvement
Stefan THURMAIER (Turbodynamics GmbH – Germany) - Applying Chiplet Concepts to Interfaces: Breaking the Barriers Holding the Industry Down
Eric SHOEMAKER, Brian BRECHT (DIS Tech – USA) - Innovative Testing Strategies for Silicon Photonic Devices in Engineering and Production Applications
Dan RISHAVY, Kainoa KEKAHUNA (FormFactor – USA) - Evaluation of Ultra-High-Multi Layer PCB (124L) for Probe Card
Yasuyuki SHINBO, Toshihiko OGURA (OKI Circuit Technology Co., Ltd. – Japan) - Enlarging the scope of process monitoring based cost reduction in probing operations
Martin KUNZ (Solarius GmbH – Germany), Franz STEGER (Texas Instruments – Germany) - High Pin Count, High Parallelism Vertical Probe Card Characterization Strategies for HVM Automotive Bump Wafer Testing
Cameron HARKER (FormFactor – USA), Yoichi URAKAWA (FormFactor – Japan) - Reinventing Guide Plates for Vertical Probe Cards: Solving Design Constraints with Advanced Laser Drilling and Materials Science
Chris STOKES (Oxford Lasers – United Kingdom) - From Concept to Extended Validation: Localized Thermal Management for AI and GPU Wafer Testing
Klaudiusz HOLECZEK (Watttron GmbH – Germany), Klemens REITINGER (ERS electronic GmbH – Germany) - New Re-Shaping Sheet for probe with High Processing and Long-Life Span
Tad ROKKAKU (Probe Innovation USA, LLC – USA) - Development of low CTE LTCC material for ST substrates
Yasuo YAMAZAKI, Eiichi NAKAMURA, Shigekatsu KONO, Takahisa YAMAGUCHI (Nippon Electric Glass Co., Ltd. – Japan)
Friday, November 21
| Time | Event |
|---|---|
| 7:30 – 17:00 | Conference Registration Check-In |
| 8:45 – 9:00 | Friday Program Overview Jerry BROZ, PhD (SWTest Conference General Chair – USA) |
| 9:00 – 10:00 |  FRIDAY VISIONARY KEYNOTE (more details)Rapidus Initiatives and Logic Testing Challenges in Advanced Semiconductor Manufacturing Atsuhiko OHNO Distinguished Engineer Technology Department #5 (Wafer/Package Test), Engineering Center (Rapidus Corporation – Japan) |
| 10:00 – 10:30 | Tea Break in EXPO Hall |
| 10:00 – 10:30 | Technical Poster Session |
| 10:00 – 16:00 | EXPO Open |
| 10:30 – 12:00 | Technical Session 4: Photonics Session Chair: Alan FERGUSON (Oxford Lasers – UK) |
| 10:30 – 11:00 | Roman ZVAHELSKYI, Andres MACHADO, Florian RUPP, Philipp-Immanuel DIETRICH (Keystone Photonics – Germany) |
| 11:00 – 11:30 | Hsu Hao CHANG, Andrew YICK, Calvin YANG, Supreet KHANAPET (Marvell – USA), Christian KARRAS, Gregor KUPKA, Tobias GNAUSCH (Jenoptik – Germany), Derek WU, Jeff JHERN, Natan CHEJANOVSKY, Shiyang DENG (Advantest – USA), Kengo SUZUKI (Advantest – Japan) |
| 11:30 – 12:00 |  A Compact OTA Measurement System with a Lens-Equipped Anechoic Chamber for Antenna-in-Package ModulesYasushi SHIRAKATA, Kenichi MITSUGI, Shoichi KOSHIKAWA, Tomohisa HOSHINO (Yokowo Co., Ltd. – Japan) |
| 12:00 – 14:00 | LUNCH in EXPO Hall |
| 12:25 – 12:45 | Tech Showcase 4 – Heraeus Precious Metals GmbH & Co. KG Title: TBD |
| 13:25 – 13:45 | Tech Showcase 5 – Japan Electronic Materials Corporation Title: TBD |
| 14:00 – 15:30 | Technical Session 5: Optical Challenges Session Chair: Muru MEYYAPPAN (Lattice Semiconductors – USA) |
| 14:00 – 14:30 |  New Method for Mounting Lens Module on Probe Card for CMOS Image Sensors testingTomonao NAKASHIMA (Japan Electronic Material Corp – Japan), Hiroki TSUTSUMI (INTER ACTION Corporation – Japan) |
| 14:30 – 15:00 |  Opto-electronic probe card with single-mode fiber array for wafer-level PIC testingTakaharu OHYAMA, Tomohisa HOSHINO, Yasushi WATANABE, Yui NIIJIMA (YOKOWO CO., LTD. – Japan) |
| 15:00 – 15:30 |  Eclipse Dynamic Probe Card: A Novel Approach for Wafer-Level Photonic Testing with Automated Fiber Array Unit AlignmentAlessia GALLI (Technoprobe – Italy), Andrew YICK, Calvin YANG, Hsu Hao CHANG (Marvell – US) |
| 15:30 – 16:00 | Tea Break in EXPO Hall |
| 15:30 – 16:00 | Technical Poster Session |
| 16:00 – 17:30 | EXPO Move-Out |
| 16:00 – 17:30 | Technical Session 6: Advance PCB Design Session Chair: Nobuhiro KAWAMATA (FormFactor – Japan) |
| 16:00 – 16:30 | Aseem SRIVASTAVA, Tom TRAN (Teradyne, Inc – USA) |
| 16:30 – 17:00 |  Evaluating PWB Power supply characteristics of Stacked vs Single Copper ConfigurationsWai Kit K (Lincstech Co., Ltd. – Japan) |
| 17:00 – 17:30 |  Breaking Boundaries: Over 160 Layers, 10mmt Main PCB Redefining High-Density InterconnectSohei YASUDA (FICT Limited – Japan) |
| 17:30 – 17:35 | SWTest Asia 2025 Technical Awards |
| 17:35 – 20:00 | Japanese Street Food Festival |
Poster Session
Session Chair: Nyi Nyi THEIN (Western Digital Corporation – Japan)
- Evaluation of Palladium Alloy Probe with Suppressed Sn Diffusion Reaction
Kenichi SATO, Tomohisa HOSHINO, Naohito ODANI (Yokowo Corporation – Japan), Shohji IKUO (Graduate School of Science and Technology, Gunma University – Japan) - Technologies to support data transmission with extremely high frequencies (400G+) on printed circuit boards
Quaid Joher FURNITUREWALA (Advantest America Inc – USA) - High Voltage DUT Power Supply IC for Automotive Grade Testing
Thomas ABIOG (Elevate Semiconductor – USA) - A Modern Low Current, Low Leakage Switch Matrix
Hai DAU, Israel ECHEVARRIA, John WILLIAMSON, Christine BUI (Spire Manufacturing, Inc. – USA) - A POGO-Type MEMS pin for Fine-Pitch Probing
Jong-Uk BU, Ho-Sub BANG, Hwangsub KOO, SangHyeop LEE, Seo KOO, Seokhwan YOO, Youngho NAM (WithMEMS – South Korea) - Probe Card Analyzer Motherboard Flexibility and Performance Improvement
Stefan THURMAIER (Turbodynamics GmbH – Germany) - Applying Chiplet Concepts to Interfaces: Breaking the Barriers Holding the Industry Down
Eric SHOEMAKER, Brian BRECHT (DIS Tech – USA) - Innovative Testing Strategies for Silicon Photonic Devices in Engineering and Production Applications
Dan RISHAVY, Kainoa KEKAHUNA (FormFactor – USA) - Evaluation of Ultra-High-Multi Layer PCB (124L) for Probe Card
Yasuyuki SHINBO, Toshihiko OGURA (OKI Circuit Technology Co., Ltd. – Japan) - Enlarging the scope of process monitoring based cost reduction in probing operations
Martin KUNZ (Solarius GmbH – Germany), Franz STEGER (Texas Instruments – Germany) - High Pin Count, High Parallelism Vertical Probe Card Characterization Strategies for HVM Automotive Bump Wafer Testing
Cameron HARKER (FormFactor – USA), Yoichi URAKAWA (FormFactor – Japan) - Reinventing Guide Plates for Vertical Probe Cards: Solving Design Constraints with Advanced Laser Drilling and Materials Science
Chris STOKES (Oxford Lasers – United Kingdom) - From Concept to Extended Validation: Localized Thermal Management for AI and GPU Wafer Testing
Klaudiusz HOLECZEK (Watttron GmbH – Germany), Klemens REITINGER (ERS electronic GmbH – Germany) - New Re-Shaping Sheet for probe with High Processing and Long-Life Span
Tad ROKKAKU (Probe Innovation USA, LLC – USA) - Development of low CTE LTCC material for ST substrates
Yasuo YAMAZAKI, Eiichi NAKAMURA, Shigekatsu KONO, Takahisa YAMAGUCHI (Nippon Electric Glass Co., Ltd. – Japan)