2025 Tech Showcase

Thursday, November 20

• Tech Showcase #1
  12:25 – 12:45
  MPI Corporation
  Advancing High-Speed and U-Bump Test Capabilities
  Details: High-speed testing has reached readiness at 224Gbps and is progressing toward 448Gbps, demonstrating the continuous evolution of next-generation test technologies. This advancement not only marks a breakthrough in speed but also reflects the growing demand to support higher data rates and more complex system integration. In parallel, u-bump testing capabilities play a critical role in ensuring reliability and consistency, serving as an essential foundation for enabling high-performance and highly integrated applications.
  
• Tech Showcase #2
  13:25 – 13:45
  Micronics Japan Co., Ltd.
  Innovative Solutions for Semiconductor Testing
  Details: At the SWTest Asia 2025 MJC Tech-Show, we are excited to introduce MJC, a leader in semiconductor testing solutions. With a rich history of innovation, MJC specializes in advanced probe cards and cutting-edge testing technologies that drive efficiency and precision in semiconductor manufacturing. Join us to explore our latest advancements and discover how MJC is shaping the future of semiconductor testing.
  
• Tech Showcase #3
  15:35 – 15:55
  FormFactor, Inc.
  Enabling Next-Generation Devices: Trends, Challenges, and Solutions in Wafer-Level Probing for Advanced Packaging and Silicon Photonics
  Details: As advanced packaging and silicon photonics technologies drive the evolution of next-generation semiconductor devices, wafer-level probing has become increasingly complex and critical.
  This session explores the latest trends shaping wafer-level probing, including the shift toward heterogeneous integration, higher-density interconnects, and the growing need for precise optical and electrical measurements. Key challenges—such as achieving nanometer-scale alignment, maintaining signal integrity across diverse device types, and scaling test solutions for high-volume manufacturing—will be addressed. We will highlight how FormFactor’s flexible, automation-ready probing systems and innovative technologies empower customers to verify device performance and yield at every stage of integration, reduce overall manufacturing costs, and make data-driven decisions from initial design through production.
  Join us to discover practical solutions and industry insights that are enabling the future of advanced packaging and silicon photonics.
  

Friday, November 21

• Tech Showcase #4
  12:25 – 12:45
  Heraeus Precious Metals GmbH & Co. KG
  Experience the Difference: From Material Innovation to Industry-Leading Foil Quality in Series Production
  Details: This Tech Showcase highlights how combining material development with advanced processing leads to high-quality foils that enhance application performance and reduce costs. In addition to Heraeus’ poster presentation, attendees can explore real foil samples and take away product data for deeper insights.
  
• Tech Showcase #5
  13:25 – 13:45
  Japan Electronic Materials Corporation
  Generative AI and Introducing “Your Probing Partner” JEM
  Details: We are excited to introduce our work at the intersection of advanced technology development and product commercialization, driven by our mission to enhance our well-being through JEM’s technology.
  As generative AI continues to evolve, probe card technology is emerging as a critical enabler of next-generation innovation.
  By fostering global partnerships across the supply chain, we seek to align on shared objectives, accelerate breakthroughs, and unlock new opportunities for growth.
  Together, we can push the boundaries of discovery and chart a unified path toward a more connected and intelligent future.